@Comment { \documentclass{article} \usepackage{url} \begin{document} This Model originally published in \cite{OpenKIM-MO:020851069572:000a} is archived in \cite{OpenKIM-MO:020851069572:000, OpenKIM-MD:120291908751:005, tadmor:elliott:2011, elliott:tadmor:2011}. \bibliographystyle{vancouver} \bibliography{kimcite-MO_020851069572_000.bib} \end{document} } @Misc{OpenKIM-MO:020851069572:000, author = {Chunli Liu and Leonard Borucki and XY Liu}, title = {{EAM} potential ({LAMMPS} cubic hermite tabulation) for the {A}l-{C}u system developed by {L}iu et al. (1999) v000}, doi = {10.25950/2dd77629}, howpublished = {OpenKIM, \url{https://doi.org/10.25950/2dd77629}}, keywords = {OpenKIM, Model, MO_020851069572_000}, publisher = {OpenKIM}, year = 2018, } @Misc{OpenKIM-MD:120291908751:005, author = {Stephen M. Foiles and Michael I. Baskes and Murray S. Daw and Steven J. Plimpton}, title = {{EAM} {M}odel {D}river for tabulated potentials with cubic {H}ermite spline interpolation as used in {LAMMPS} v005}, doi = {10.25950/68defa36}, howpublished = {OpenKIM, \url{https://doi.org/10.25950/68defa36}}, keywords = {OpenKIM, Model Driver, MD_120291908751_005}, publisher = {OpenKIM}, year = 2018, } @Article{tadmor:elliott:2011, author = {E. B. Tadmor and R. S. Elliott and J. P. Sethna and R. E. Miller and C. A. Becker}, title = {The potential of atomistic simulations and the {K}nowledgebase of {I}nteratomic {M}odels}, journal = {{JOM}}, year = {2011}, volume = {63}, number = {7}, pages = {17}, doi = {10.1007/s11837-011-0102-6}, } @Misc{elliott:tadmor:2011, author = {Ryan S. Elliott and Ellad B. Tadmor}, title = {{K}nowledgebase of {I}nteratomic {M}odels ({KIM}) Application Programming Interface ({API})}, howpublished = {\url{https://openkim.org/kim-api}}, publisher = {OpenKIM}, year = 2011, doi = {10.25950/ff8f563a}, } @Article{OpenKIM-MO:020851069572:000a, author = {Liu, X.-Y and Liu, C.-L and Borucki, L.J}, doi = {10.1016/S1359-6454(99)00186-X}, journal = {Acta Materialia}, number = {11}, pages = {3227 - 3231}, title = {A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view}, volume = {47}, year = {1999}, }